Why Scarcity, Not Warpage, Will Force the Next Leap in Advanced Packaging

The AI processor is losing the package substrate to save the timeline. For the rest of the supply chain, it's the new blueprint for value creation.

CES 2026 confirmed the shift to Bounded Platforms. The new winners aren't chasing raw speed. They are mastering the bottlenecks: Thermals (The Ceiling), Interconnects (The Enabler) and Power Density (The Governor)